Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy

Abstract

The aim of these work is to measure the effect of the addition of In with different atomic percent weight on structure, melting, Electrical and mechanical properties of Sn_70-X at.% -Bi₁₅ at.% -Sb₁₅ at.%- In_x at.% rapidly solidified. X-ray diffraction analysis (XRD), differential scanning calorimetry (DSC), temperature dependence of resistivity (TDR), and mechanical resonance method are performed. It's found that electrical conductivity (σ) and thermal conductivity (K) increased gradually by increasing In at.%. Melting temperature reduced from 470.12 K for Sn₇₀ at.%- Bi₁₅ at.%- Sb₁₅ at.% to 427.13 K in Sn₆₁ at.%- Bi₁₅ at.%- Sb₁₅ at.%- In₉ at.%. Also, elastic moduli, internal friction and thermal diffusivity measured from melt-quenched ribbons.