Modification in Bi-Ag Lead-Free Solder-Bearing Alloying Elements

Authors

  • Rizk Mostafa Shalaby Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, Egypt,
  • Musaeed Allzeleh M.Sc student, Ministry of Higher Education
  • Mustafa Kamal Metal Physics Lab., Physics Department, Faculty of Science, Mansoura University, Mansoura, Egypt, B. O. Pox: 35516

DOI:

https://doi.org/10.24297/jap.v14i2.7471

Keywords:

Rapid solidification, Bi-Ag-RE lead free solder, microstructure, mechanical behavior

Abstract

The development of lead-free solder has an urgent task for material scientist due to health and environmental concerns over the lead content of traditional solders. The objective of this study is to examine Bi-Ag-rare earth (RE) element considered as one of the more attractive lead-free solders since it can easily replace Sn-Pb eutectic alloy with increasing soldering temperature while causes for high-temperature applications. In order to enhance the soldering properties of Bi-Ag alloys, a trace eare earth (RE) element of Ho added into Bi-Ag alloys. The results indicated that the addition of RE led to the refining of coarse Bi-Ag grains, in the microstructure. The tensile strength, Hv and creep resistance increased with a decrease in melting point and electrical resistance. This paper brief the influences of rare earth alloying element and rapid solidification on both of the microstructure, intermetallic compounds, creep resistance, melting behavior, electrical resistance and mechanical behavior.

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Published

2018-06-30

How to Cite

Shalaby, R. M., Allzeleh, M., & Kamal, M. (2018). Modification in Bi-Ag Lead-Free Solder-Bearing Alloying Elements. JOURNAL OF ADVANCES IN PHYSICS, 14(2), 5504–5519. https://doi.org/10.24297/jap.v14i2.7471

Issue

Vol. 14 No. 2

Section

Articles

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