Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly

Authors

  • Rizk Mostafa Shalaby Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, Mansoura, Egypt, B.O.Box: 35516
  • Fatma Elzahraa Ibrahim faculty of science, mansoura university
  • Mostafa Kamal Metal Physics Laboratory, Physics Department, Faculty of Science, Mansoura University, Mansoura, Egypt, B.O.Box: 35516

DOI:

https://doi.org/10.24297/jap.v16i1.8239

Keywords:

eutectic Sn-Ag, lead free solder, Terbium additions, microstructures, mechanical properties, thermal properties

Abstract

This work methodically concentrated on the effect of a trace amount of rare earth element terbium, Tb (0.1, 0.2, 0.3, 0.4 and 0.5 wt. %) on the properties of eutectic Sn-3.5 wt. %Ag were studied. The results indicated that addition of Tb rare earth can be refined the microstructure of the solder and intermetallic compound (IMC) Ag3Sn phase appeared in the solder matrix. Add a few quantity of rare earth Tb enhances the hardness and strength of eutectic Sn-Ag lead free solder joint. Also, results indicate that adding Tb to the eutectic Sn-3.5Ag remarkably enhances solderability, reliability, thermal and mechanical properties. It is also found that increasing in mechanical strength can depend on crystalline size refining in addition to some regular precipitates from IMC, Ag3Sn.

Downloads

Download data is not yet available.

References

Ku, A., Oetinscitan, O., Saphores, J.-D., and Shapirod, A., Schoenunp, J.M.," Lead-free solders. issues of toxicity, availability and impacts of extraction, "Electronic Components and Technology Conference , 2003, p. 47 – 53(in English)

M.H.Braga, J. Vizdal ,A.Kroup , J.Ferreirad, D.Soares ,and L.F.Malheiros, "The experimental study of the Bi-Sn, Bi-Zn and Bi-Sn-Zn system, "Science Direct., 2007,31, p.468-478(in English)

A.A.EL-Daly,Y.swilim ,M.H.Makleb ,M.G Elshaarawy, and A.M.Abdraboh, "Thermal and mechanical of Sn-Zn-Bi lead-free solder alloys, "J. alloys and compounds., 2009,484, p.134-142,(in English)

ZHAI Wei , and WEI Bingo, "Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys,"Material .sci., 2013,58(8), p.938-944 (in English)

M.Kamal ,and E.S. Goda , "Enhancement of solder properties of Sn-9Zn lead –free solder alloy,"cryst.res.Technol., , 2006,41(12), p.1210-1213(in English)

R. M.Shalaby, “Indium, chromium and nickel - modified eutectic Sn- 0.7 wt.% rapidly solidified from molten state,” J.Materials Sci, Mater Electron, 2015,26(9), p.6625–6632(in English)

R. M.Shalaby, “Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys” , J. Advances in Physics,2015,9(1), p.2287-2298(in English)

R. M. Shalaby, and Mustafa Kamal, "Influence of In and Se addition on the mechanical properties of Sn-5Sb- 2Cu bearing alloys,"International Journal of Physics and Research(IJPR).,2013,3,p.51-60(in English)

Mustafa Kamal, and R. M. Shalaby," Effect of reactive metal on creep resistance of Sn-50Bi lead free solder alloys," International Journal of Physics and Research(IJPR),2014,4(5), p.19-28(in English)

R.M.Shalaby, "Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys," Materials Science and Engineering A., 2013,560, p.86-95(in English)

R.M.Shalaby, "Influence of indium addition on structure, mechanical, thermal and electrical properties of tin-antimony based metallic alloys quenched from melt, "Journal of Alloys and Compounds.,2009,25(2), p.334-339(in English)

R.M.Shalaby, "Effect of Silicon Addition on Mechanical and electrical properties of Sn-Zn based alloys rapidly quenched from melt, "Materials Science and Engineering A., 2012,550, p.112-117(in English)

R.M.Shalaby, "Effect of indium content and rapid solidification on microhardness and micro-creep of Sn-Zn eutectic lead free solder alloy," Crystal Research and Technology,2010,45(4),p.427-432(in English)

T.El-Ashram, and R.M.Shalaby, "Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy," Journal of Electronic Materials.,2005,34(2), p.212-215(in English)

R.M.Shalaby, "Effect of rapid solidification on mechanical properties of a lead free Sn-3.5Ag solder," Journal of Alloys and Compounds.,2010,505(1), p.113-117 (in English)

Prerna Mishra, S.N.Alam, and Rajinish Kumar ,"Effect Of Rare Earth on Lead Free Solder Alloys", IJERA, ISSN.2284-9622 ,pp.80-86, (2014).

Boli,Yaowe Shi, Yon Gping lei, Zhidong Xia, and Bin Zong ,"Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint ,"J. Electronic Materials.,2005,34(3), p.217-224 (in English)

Yaoeu Shi, Jun Tian, Hu Hao, Zhidong Xia, Youngping Lei, and Fu Guo ,"Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder,"J,alloys and compounds.,2008, 453 ,p.180-184 (in English)

Jun Shen .Cuiping and Wu . Shizeng Li ,"Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bio.5Cu and Sn35BilAg solder alloys,"J Mater Sci .Mater electron., 2012,23 ,p.156-163(in English)

ZHAO Xiao-yan, ZHAO Mai-qun, CUI Xiao_qing, XU Tian-han, and TONG Ming-xin ,"Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys ,"Science Press., 2007,17,p. 805-810(in English)

Lili Gao , Songbai Xui , Liang Zhong Sheng , GuangZeng, and Feng Ji ,"Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder," J Mater Sci. Mater Electron.,2010,21,p.643-648(in English)

Liang Zhang , Song-bai Xue .Li-li Gao , Yan Chen , Sheng-lin Yu , Zhong Sheng ,and Guang Zeng ,"Effect of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys" J mater Sci. Mater electronic.,2009,20, p.1193-1119(in English)

Lu Zhong, Zhou Jian , SUN Zhimei ,and CHEN RongShi ,"Effect of rare earth elements on the structures and mechanical properties of magnesium alloys," Materials science.,2013, 58(7), p.816-820(in English)

ZHANG Liang, XUE Song-bai, GAO Li-li, ZENG Guang,CHEN Yan, YU Sheng-lin, and SHENG Zhong ,"Creep behavior of SnAgCu with rare Ce doping " ,Science Direct.,2010,20, p.412-417(in English)

WenXue Chen , Songbai Xue , YuHua Hu , and Jianxin Wang," Effect of rare earth Ce on properties of Sn-9Zn lead- free solder", J Mater sci .Mater Electron, 2010, 21, p.719-725(in English)

Janka CHRIASTELOVA, Katarina POCISKOVA DIMOVA, Lydia RIZEKOVA TRNKOVA, Jan LOKAJ, Milan TURNA,and MILAN OZVOLD ,"Intermetallic Compounds Formed Between Cu Substrates And Lead-Free Solders Containing Ce" ,Metal .,2010, 8,(in English)

M.Kamal, A.M.Shaban, M.El-Kady and R.M.Shalaby," Irradiation, mechanical and structure behavior of Aluminium-Zinc based alloys rapidly quenched from melt", Radiation Effects and Defects in Solids, OPA.,1996,138, p.307-318(in English)

M.Kamal, A.M.Shaban, M.El-Kady and R.M.Shalaby," Determination of structure-property of rapidly quenched aluminium-based bearing alloys before and after gamma irradiation", 2nd International Conference of Engineering Physics and Mathematics, Faculty of Engineering, Cairo University, Cairo.,1994,2, p.107-121(in English)

Robert M. Ras, Lawrence A. Shepard, John Weilff, Structure and properties of materials, Electronic properties, W.E.P. Ltd. 3rd Edn1992, ,4, p.333(in English)

Downloads

Published

2019-05-05

How to Cite

Shalaby, R. M., Ibrahim, F. E., & Kamal, M. (2019). Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly. JOURNAL OF ADVANCES IN PHYSICS, 16(1), 79–94. https://doi.org/10.24297/jap.v16i1.8239

Issue

Section

Articles

Most read articles by the same author(s)