Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy

Authors

  • Sara Mosaad Mahlab Suez Canal University, Egypt
  • Mustafa Kamal Prof. of metal physics, physics dep., faculty of Science, Mansoura University
  • Abd El-Raouf mohamed Mansour Prof. of solid state physics, physics dep., faculty of Science, Port-Said University

DOI:

https://doi.org/10.24297/jap.v12i2.56

Keywords:

Rapid Solidification (RS), Lead Free Solder Alloys, Sn-Bi-Sb, X-Ray Diffraction Analysis (XRD), Electrical Resistivity, Thermal analysis, Mechanical properties.

Abstract

The aim of these work is to measure the effect of the addition of In with different atomic percent weight on structure, melting, Electrical and mechanical properties of Sn70-X at.% -Bi15 at.% -Sb15 at.%- Inx at.% rapidly solidified. X-ray diffraction analysis (XRD), differential scanning calorimetry (DSC), temperature dependence of resistivity (TDR), and mechanical resonance method are performed. It's found that electrical conductivity (σ) and thermal conductivity (K) increased gradually by increasing In at.%. Melting temperature reduced from 470.12 K for Sn70 at.%- Bi15 at.%- Sb15 at.% to 427.13 K in Sn61 at.%- Bi15 at.%- Sb15 at.%- In9 at.%. Also, elastic moduli, internal friction and thermal diffusivity measured from melt-quenched ribbons.

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Author Biography

Sara Mosaad Mahlab, Suez Canal University, Egypt

assistant lecrturer, physics dep., faculty of Science, Suez Canal University

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Published

2016-08-30

How to Cite

Mahlab, S. M., Kamal, M., & Mansour, A. E.-R. mohamed. (2016). Characterization of Indium addition on Sn-Bi-Sb Lead free Solder alloy. JOURNAL OF ADVANCES IN PHYSICS, 12(2), 4231–4243. https://doi.org/10.24297/jap.v12i2.56

Issue

Vol. 12 No. 2

Section

Articles

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