Yassin AM, Afify RI, Khalifa B. Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders. JAP [Internet]. 2018 Sep. 25 [cited 2024 May 5];14(3):5835-50. Available from: https://rajpub.com/index.php/jap/article/view/7834