Yassin, Amal Mohamed, Reda Ismail Afify, and Berlent Khalifa. “Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders”. JOURNAL OF ADVANCES IN PHYSICS 14, no. 3 (September 25, 2018): 5835–5850. Accessed May 5, 2024. https://rajpub.com/index.php/jap/article/view/7834.