Shalaby, R. M., F. E. Ibrahim, and M. Kamal. “Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly”. JOURNAL OF ADVANCES IN PHYSICS, vol. 16, no. 1, May 2019, pp. 79-94, doi:10.24297/jap.v16i1.8239.