Shalaby, R. M. “Effect of Rapid Solidification on Microstructure, Creep Resistance and Thermal Properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) Lead-Free Solder Alloys”. JOURNAL OF ADVANCES IN PHYSICS, vol. 9, no. 1, May 2015, pp. 2287-98, doi:10.24297/jap.v9i1.1469.