YASSIN, A. M.; AFIFY, R. I.; KHALIFA, B. Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders. JOURNAL OF ADVANCES IN PHYSICS, [S. l.], v. 14, n. 3, p. 5835–5850, 2018. DOI: 10.24297/jap.v14i3.7834. Disponível em: https://rajpub.com/index.php/jap/article/view/7834. Acesso em: 5 may. 2024.