SHALABY, R. M. Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys. JOURNAL OF ADVANCES IN PHYSICS, [S. l.], v. 9, n. 1, p. 2287–2298, 2015. DOI: 10.24297/jap.v9i1.1469. Disponível em: https://rajpub.com/index.php/jap/article/view/1469. Acesso em: 28 mar. 2024.