YASSIN, A. M.; KHALIFA, B.; ISMAIL, R. A. Indentation Creep and Microstructure Properties of Sn-Ag Solder Alloys. JOURNAL OF ADVANCES IN PHYSICS, [S. l.], v. 16, n. 1, p. 171–184, 2019. DOI: 10.24297/jap.v16i1.8243. Disponível em: https://rajpub.com/index.php/jap/article/view/8243. Acesso em: 22 dec. 2024.