SHALABY, R. M.; IBRAHIM, F. E.; KAMAL, M. Effect of Terbium Additions on Microstructural, Thermal and Mechanical Properties of Eutectic Sn-3.5Ag Pb- Free Solder for Low Cost Electronic Assembly. JOURNAL OF ADVANCES IN PHYSICS, [S. l.], v. 16, n. 1, p. 79–94, 2019. DOI: 10.24297/jap.v16i1.8239. Disponível em: https://rajpub.com/index.php/jap/article/view/8239. Acesso em: 21 dec. 2024.