Shalaby, R. M. (2015). Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys. JOURNAL OF ADVANCES IN PHYSICS, 9(1), 2287–2298. https://doi.org/10.24297/jap.v9i1.1469