Loganathan, Arulmurugan, and Ilangkumaran Mani. “Experimental Investigations on Thermal Performance of Copper With Aluminium Based Finned Heat Sinks for Electronics Cooling System”. JOURNAL OF ADVANCES IN CHEMISTRY 12, no. 12 (June 15, 2016): 4582–4587. Accessed November 23, 2024. https://rajpub.com/index.php/jac/article/view/787.