LOGANATHAN, A.; MANI, I. Experimental investigations on Thermal Performance of Copper with Aluminium Based Finned Heat sinks for Electronics Cooling System. JOURNAL OF ADVANCES IN CHEMISTRY, [S. l.], v. 12, n. 12, p. 4582–4587, 2016. DOI: 10.24297/jac.v12i12.787. Disponível em: https://rajpub.com/index.php/jac/article/view/787. Acesso em: 23 nov. 2024.