Yassin, A. M., B. Khalifa, and R. A. Ismail. “Indentation Creep and Microstructure Properties of Sn-Ag Solder Alloys”. JOURNAL OF ADVANCES IN PHYSICS, vol. 16, no. 1, May 2019, pp. 171-84, doi:10.24297/jap.v16i1.8243.